Product name: Molybdenum Discs/Squares
Standard: ASTM B386
Material: Mo >99.95%
Density: 9.8 ~ 10.2g/cc
Molybdenum Discs/Squares has a similar low coefficient of thermal expansion to that of silicon, and better machining properties. For that reason, it's usually used for heat dissipation as electronic component of high power and high reliability semiconductor, contact materials in silicon controlled rectifiers diodes, transistors and thyristors (GTO'S), mounting material for power semiconductor��heat sink bases in IC'S, LSI'S and hybrid circuits.
The polishing surface and lapping surface are both available.
Molybdenum disc 7 ~ 100mm diameter, 0.25 ~ 4.0mm thickness
Molybdenum square 25 ~ 100mm2, 0.5 ~ 1.5mm thickness
Flatness tolerance: < 4um
Roughness: Ra 0.8